The appearance of MEMS IC Packaging System | Intelligent Process Equipment: The Role of Smart Machinery in Automated Systems.

MEMS IC Packaging System | Shuz Tung Machinery Industrial has won considerable trust and support from domestic and international major companies from semiconductor, flat panel display processes, Printed circuit board, intelligent medical imaging, turnkey planning for bicycles, and parts processing of automobiles, scooters, and variety of industries.

MEMS IC Packaging System - The appearance of MEMS IC Packaging System
  • MEMS IC Packaging System - The appearance of MEMS IC Packaging System

MEMS IC Packaging System

Troika 1630 II

MEMS IC Packaging System is combined with automatic dispensing + AOI + Cap Mount function, flexible design allows the machine to be equipped with front and rear automatic loading/unloading, satisfying the customer's production line needs.

⇒ Precise Glue Volume Control.
⇒ Real-time glue application monitoring and correction mechanism.
⇒ Automatic glue cleaning and test coating area.
⇒ Support various types of adhesives such as epoxy resin, resin, solder paste, silver paste, and other multi-point dispensing modes.
⇒ Compatible with Underfill and other dispensing processes.

Automated Optical Inspection System (AOI)
  • "Fly Capture" high-speed inspection system.
  • Can identify low-contrast patterns.
  • High resolution.
Top cover
  • Precise positioning linear (X, Y) including rotation (θ).
  • With soft-land function, can be used for fragile chips and glass.
  • Tray and tape reel feeding system.
Features
  • Flexible production, Devices that can be connected in series or independently.
  • Fully automatic double production line to increase production efficiency.
  • Magzine Load / Unload.
  • Glue real-time image observation.
  • Graphical die selection function.
  • Process data between stations can be transferred and integrated.
  • Customized function.
Specification
  • Automatic substrate glue application function.
  • AOI detection of glue quality (glue width, glue break).
  • Mount the cover on the substrate and glue it.
  • Flexible production.
  • Can be used in series with 3 stations in one, sharing a set of Load / Unloader modules.
  • Can be split into 3 independent devices, additionally equipped with Load / Unloader module (optional).

MEMS IC Packaging System | Made in Taiwan Intelligent Process Equipment | Shuz Tung

Based in Taiwan since 1979, Shuz Tung Machinery Industrial Co., Ltd. is a manufacturer of intelligent process equipment. It's main intelligent process equipment include, MEMS IC Packaging System, semiconductor automation equipment, semiconductor metrology and inspection equipment, flat panel display turnkey equipment, TFT-LCD module process whole line equipment and wafer shipper automatic packing and unpacking machines. We offer customized designs for optimal equipment efficiency in high-tech industries. Prioritizing speed of production, quality and environmental friendliness ensures competitive advantage and significant added value.

Established in 1979, with 43 years vast experience and resources in customized equipment manufacturing, and outstanding optical, mechanical, electronic, software, and system integration ability, Shuz Tung Machinery Industrial focuses on the core technologies, including Precision Mold Manufacturing, Laser Repair and Cutting, High Accuracy Bonding (PCB Bonder), Automatic Optical Inspection (AOI), Artificial Intelligence Imaging, and Turnkey Solution for Smart Manufacturing.

Shuz Tung has been providing customers with high quality intelligent process equipment since 1979, both with advanced technology and 30 years of experience, Shuz Tung ensures that each customer's needs are met.