IC Substrate 3D Profile Measurement Equipment | Intelligent Process Equipment for Industry 4.0. Manufacturing | Shuz Tung
IC Substrate 3D Profile Measurement Equipment manufacturer. Printed circuit board manufacturing is developing towards high density and narrow line width. IC substrate 3D profile measurement equipment provides high-resolution 3D profile measurement functions to meet customers' key parameters measurement needs such as copper foil wires, through-hole dimple, and surface roughness. To improve customer production yield. Shuz Tung is a high-quality IC Substrate 3D Profile Measurement Equipment, Automatic Wafer Inspection manufacturer from Taiwan since 1979. Shuz Tung Electronic Equipment Business Unit was established in 2001, focuses on the high-tech electronics equipment field, dedicated to the research and development, design, and manufacturing of automated production equipment and process inspection and measurement equipment. Established in 1979, with 43 years vast experience and resources in customized equipment manufacturing, and outstanding optical, mechanical, electronic, software, and system integration ability, Shuz Tung Machinery Industrial focuses on the core technologies, including Precision Mold Manufacturing, Laser Repair and Cutting, High Accuracy Bonding (PCB Bonder), Automatic Optical Inspection (AOI), Artificial Intelligence Imaging, and Turnkey Solution for Smart Manufacturing.
IC Substrate 3D Profile Measurement Equipment
PWI-5000
Automatic Wafer Inspection
Printed circuit board manufacturing is developing towards high density and narrow line width. IC substrate 3D profile measurement equipment provides high-resolution 3D profile measurement functions to meet customers' key parameters measurement needs such as copper foil wires, through-hole dimple, and surface roughness. To improve customer production yield.
Features
- Integrate high-resolution 2D and 3D measurement functions.
- Through-hole dimple measurement and analysis function.
- Customizable measurement data report and data output.
Specification
- Objective Magnification: 5X, 10X, 20X, 50X (optional)
- Step Height Accuracy: ≤ 0.5% @ 1.8 μm VLSI SRM
- Measurement Items: Copper foil wire (Width, Space, Thickness), tin pad and via hole (CD, Depth), via hole dimple, surface roughness, etching (Width, Space, Depth), etc.
- Equipment Size: 1420mm (L) x 1220mm (W) x 1685mm (H)
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IC Substrate 3D Profile Measurement Equipment | Made in Taiwan Intelligent Process Equipment | Shuz Tung
Based in Taiwan since 1979, Shuz Tung Machinery Industrial Co., Ltd. is a manufacturer of intelligent process equipment. It's main intelligent process equipment include, IC Substrate 3D Profile Measurement Equipment, semiconductor automation equipment, semiconductor metrology and inspection equipment, flat panel display turnkey equipment, TFT-LCD module process whole line equipment and wafer shipper automatic packing and unpacking machines. We offer customized designs for optimal equipment efficiency in high-tech industries. Prioritizing speed of production, quality and environmental friendliness ensures competitive advantage and significant added value.
Established in 1979, with 43 years vast experience and resources in customized equipment manufacturing, and outstanding optical, mechanical, electronic, software, and system integration ability, Shuz Tung Machinery Industrial focuses on the core technologies, including Precision Mold Manufacturing, Laser Repair and Cutting, High Accuracy Bonding (PCB Bonder), Automatic Optical Inspection (AOI), Artificial Intelligence Imaging, and Turnkey Solution for Smart Manufacturing.
Shuz Tung has been providing customers with high quality intelligent process equipment since 1979, both with advanced technology and 30 years of experience, Shuz Tung ensures that each customer's needs are met.