FOUP / FOSB Automatic Wafer Carrier Packing Equipment | Intelligent Process Equipment: The Role of Smart Machinery in Automated Systems.

FOUP / FOSB Auto Packing Machine | Shuz Tung Machinery Industrial has won considerable trust and support from domestic and international major companies from semiconductor, flat panel display processes, Printed circuit board, intelligent medical imaging, turnkey planning for bicycles, and parts processing of automobiles, scooters, and variety of industries.

Automatic Wafer Carrier Packing Equipment - FOUP / FOSB Automatic Wafer Carrier Packing Equipment
  • Automatic Wafer Carrier Packing Equipment - FOUP / FOSB Automatic Wafer Carrier Packing Equipment

Automatic Wafer Carrier Packing Equipment

SPK

FOUP / FOSB Auto Packing Machine

Automatic Wafer Carrier Packing is mainly used for wafer shipment and inter-factory transfer, which can save labor force, reduce work safety problems, improve wafer packaging quality, ensure the airtightness of wafer carrier packaging, and effectively reduce wafer fragments risks caused by manual operation. Wafer carriers (FOUP, FOSB), desiccant packet, humidity cards and customer labels can be vacuum sealed into specified bag types to meet customers' needs.

Features
  • Optional single or double layer packing.
  • RFID automatic disassembly / loading function, recyclable RFID.
  • Automatic vacuum heat sealing.
  • On-power feeding.
  • Traceable process records.
  • N2 Purge gas-filling function.
  • OHT & AGV are connectable with the system.
Applications

Semiconductor wafer manufacturing, packaging, testing and related industries.

Specification
  • UPH ≥ 40
  • MCBI ≥ 2000
  • Carrier Types: FOUP / FOSB (12"), POD (8")
  • Applicable Packaging Bags: Aluminum Bags, Antistatic Bags, Transparent Bags
Gallery

Automatic Wafer Carrier Packing Equipment | Made in Taiwan Intelligent Process Equipment | Shuz Tung

Based in Taiwan since 1979, Shuz Tung Machinery Industrial Co., Ltd. is a manufacturer of intelligent process equipment. It's main intelligent process equipment include, Automatic Wafer Carrier Packing Equipment, semiconductor automation equipment, semiconductor metrology and inspection equipment, flat panel display turnkey equipment, TFT-LCD module process whole line equipment and wafer shipper automatic packing and unpacking machines. We offer customized designs for optimal equipment efficiency in high-tech industries. Prioritizing speed of production, quality and environmental friendliness ensures competitive advantage and significant added value.

Established in 1979, with 43 years vast experience and resources in customized equipment manufacturing, and outstanding optical, mechanical, electronic, software, and system integration ability, Shuz Tung Machinery Industrial focuses on the core technologies, including Precision Mold Manufacturing, Laser Repair and Cutting, High Accuracy Bonding (PCB Bonder), Automatic Optical Inspection (AOI), Artificial Intelligence Imaging, and Turnkey Solution for Smart Manufacturing.

Shuz Tung has been providing customers with high quality intelligent process equipment since 1979, both with advanced technology and 30 years of experience, Shuz Tung ensures that each customer's needs are met.